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Kevin Winstel

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2010 – 2019

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2010
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Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon:
Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. 3DIC 2010: 1-4
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Gregory Riou, Gweltaz Gaudin, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon, Boris V. Kamenev, Michael Darwin, Robert Sachs:
Pre bonding metrology solutions for 3D integration. 3DIC 2010: 1-5

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