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S. Y. Teo

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2004
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T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma:
The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectron. Reliab. 44(4): 603-609 (2004)

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