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Tz-Cheng Chiu

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Journal Articles

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2018
[j5]
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Tz-Cheng Chiu, En-Yu Yeh:
Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging. Microelectron. Reliab. 80: 14-23 (2018)
2015
[j4]
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  - journals/mr/ChiuLHYT15
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Tz-Cheng Chiu, Bo-Sheng Lee, Dong-Yi Huang, Yu-Ting Yang, Yi-Hsiu Tseng:
Time-domain viscoelastic constitutive model based on concurrent fitting of frequency-domain characteristics. Microelectron. Reliab. 55(11): 2336-2344 (2015)
2012
[j3]
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  - journals/mr/ChiuC12
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Tz-Cheng Chiu, Chun-Hui Chen:
A numerical procedure for simulating delamination growth on interfaces of interconnect structures. Microelectron. Reliab. 52(7): 1464-1474 (2012)
2011
[j2]
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  - journals/mr/ChiuHL11
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Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai:
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. Microelectron. Reliab. 51(12): 2263-2273 (2011)
2010
[j1]
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  - journals/mr/ChiuLYG10
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Tz-Cheng Chiu, Jyun-Ji Lin, Hung-Chun Yang, Vikas Gupta:
Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load. Microelectron. Reliab. 50(12): 2037-2050 (2010)

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