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BibTeX record conf/3dic/ChenLC19
@inproceedings{DBLP:conf/3dic/ChenLC19, author = {Po{-}Chih Chen and Demin Liu and Kuan{-}Neng Chen}, title = {Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 {\textdegree}C}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, pages = {1--4}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/3DIC48104.2019.9058866}, doi = {10.1109/3DIC48104.2019.9058866}, timestamp = {Sun, 19 Apr 2020 18:57:24 +0200}, biburl = {https://dblp.org/rec/conf/3dic/ChenLC19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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