BibTeX record conf/3dic/CioccioGTSBVZVDLABCCC09

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@inproceedings{DBLP:conf/3dic/CioccioGTSBVZVDLABCCC09,
  author       = {L{\'{e}}a Di Cioccio and
                  Pierric Gueguen and
                  Rachid Taibi and
                  Thomas Signamarcheix and
                  Laurent Bally and
                  Laurent Vandroux and
                  Marc Zussy and
                  Sophie Verrun and
                  J{\'{e}}r{\^{o}}me Dechamp and
                  Patrick Leduc and
                  Myriam Assous and
                  David Bouchu and
                  Fran{\c{c}}ois de Crecy and
                  Laurent{-}Luc Chapelon and
                  Laurent Clavelier},
  title        = {An innovative die to wafer 3D integration scheme: Die to wafer oxide
                  or copper direct bonding with planarised oxide inter-die filling},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306534},
  doi          = {10.1109/3DIC.2009.5306534},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/CioccioGTSBVZVDLABCCC09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}