BibTeX record conf/3dic/CivaleTPJADSTB09

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@inproceedings{DBLP:conf/3dic/CivaleTPJADSTB09,
  author       = {Yann Civale and
                  Deniz Sabuncuoglu Tezcan and
                  Harold G. G. Philipsen and
                  P. Jaenen and
                  Rahul Agarwal and
                  F. Duval and
                  Philippe Soussan and
                  Youssef Travaly and
                  Eric Beyne},
  title        = {Die stacking using 3D-wafer level packaging copper/polymer through-si
                  via technology and Cu/Sn interconnect bumping},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306559},
  doi          = {10.1109/3DIC.2009.5306559},
  timestamp    = {Thu, 14 Oct 2021 09:53:39 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/CivaleTPJADSTB09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}