BibTeX record conf/3dic/DiengABGLJHFLF14

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@inproceedings{DBLP:conf/3dic/DiengABGLJHFLF14,
  author       = {Khadim Dieng and
                  Philippe Artillan and
                  C{\'{e}}dric Bermond and
                  Olivier Guiller and
                  Thierry Lacrevaz and
                  Sylvain Joblot and
                  Gregory Houzet and
                  Alexis Farcy and
                  Yann Lamy and
                  Bernard Fl{\'{e}}chet},
  title        = {Electrical model and characterization of Through Silicon Capacitors
                  {(TSC)} in silicon interposer},
  booktitle    = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
                  Ireland, December 1-3, 2014},
  pages        = {1--8},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/3DIC.2014.7152152},
  doi          = {10.1109/3DIC.2014.7152152},
  timestamp    = {Fri, 09 Apr 2021 18:38:11 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/DiengABGLJHFLF14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}