BibTeX record conf/3dic/EgawaFNMTK10

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@inproceedings{DBLP:conf/3dic/EgawaFNMTK10,
  author       = {Ryusuke Egawa and
                  Yusuke Funaya and
                  Ryu{-}ichi Nagaoka and
                  Akihiro Musa and
                  Hiroyuki Takizawa and
                  Hiroaki Kobayashi},
  title        = {Design and early evaluation of a 3-D die stacked chip multi-vector
                  processor},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2010,
                  Munich, Germany, 16-18 November 2010},
  pages        = {1--8},
  publisher    = {{IEEE}},
  year         = {2010},
  url          = {https://doi.org/10.1109/3DIC.2010.5751448},
  doi          = {10.1109/3DIC.2010.5751448},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/EgawaFNMTK10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}