BibTeX record conf/3dic/FengWSAK19

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@inproceedings{DBLP:conf/3dic/FengWSAK19,
  author       = {Wei Feng and
                  Naoya Watanabe and
                  Haruo Shimamoto and
                  Masahiro Aoyagi and
                  Katsuya Kikuchi},
  title        = {Thermal Stress Comparison of Annular-Trench-Isolated {(ATI)} {TSV}
                  with Cu and Solder Core},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058787},
  doi          = {10.1109/3DIC48104.2019.9058787},
  timestamp    = {Sun, 19 Apr 2020 18:57:24 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/FengWSAK19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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