BibTeX record conf/3dic/KimKKBJKKLP13

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@inproceedings{DBLP:conf/3dic/KimKKBJKKLP13,
  author       = {Jonghoon J. Kim and
                  Heegon Kim and
                  Sukjin Kim and
                  Bumhee Bae and
                  Daniel H. Jung and
                  Sunkyu Kong and
                  Joungho Kim and
                  Junho Lee and
                  Kunwoo Park},
  title        = {Non-contact wafer-level {TSV} connectivity test methodology using
                  magnetic coupling},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702328},
  doi          = {10.1109/3DIC.2013.6702328},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KimKKBJKKLP13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}