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BibTeX record conf/3dic/NakamuraMKKMKSHKAUO13
@inproceedings{DBLP:conf/3dic/NakamuraMKKMKSHKAUO13, author = {Tadao Nakamura and Yoriko Mizushima and Hideki Kitada and Young{-}Suk Kim and Nobuhide Maeda and Shoichi Kodama and Ryuichi Sugie and Hiroshi Hashimoto and Akihito Kawai and Kazuhisa Arai and Akira Uedono and Takayuki Ohba}, title = {Influence of wafer thinning process on backside damage in 3D integration}, booktitle = {2013 {IEEE} International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013}, pages = {1--6}, publisher = {{IEEE}}, year = {2013}, url = {https://doi.org/10.1109/3DIC.2013.6702400}, doi = {10.1109/3DIC.2013.6702400}, timestamp = {Sun, 25 Oct 2020 22:39:05 +0100}, biburl = {https://dblp.org/rec/conf/3dic/NakamuraMKKMKSHKAUO13.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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