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BibTeX record conf/3dic/SantosSCCCVBRJF14
@inproceedings{DBLP:conf/3dic/SantosSCCCVBRJF14, author = {Cristiano Santos and Papa Momar Souare and Fran{\c{c}}ois de Crecy and Perceval Coudrain and Jean{-}Philippe Colonna and Pascal Vivet and Andras Borbely and Ricardo Reis and M. Haykel Ben Jamaa and Vincent Fiori and Alexis Farcy}, title = {Using TSVs for thermal mitigation in 3D circuits: Wish and truth}, booktitle = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014}, pages = {1--8}, publisher = {{IEEE}}, year = {2014}, url = {https://doi.org/10.1109/3DIC.2014.7152167}, doi = {10.1109/3DIC.2014.7152167}, timestamp = {Thu, 21 Jan 2021 17:36:37 +0100}, biburl = {https://dblp.org/rec/conf/3dic/SantosSCCCVBRJF14.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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