BibTeX record conf/3dic/ScheuermannTRWB16

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@inproceedings{DBLP:conf/3dic/ScheuermannTRWB16,
  author       = {Michael Scheuermann and
                  Shurong Tian and
                  Raphael Robertazzi and
                  Matthew R. Wordeman and
                  C. Bergeron and
                  H. Jacobson and
                  Phillip J. Restle and
                  Joel Silberman and
                  Christy Tyberg},
  title        = {Thermal analysis of multi-layer functional 3D logic stacks},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7969996},
  doi          = {10.1109/3DIC.2016.7969996},
  timestamp    = {Fri, 25 Feb 2022 16:48:31 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/ScheuermannTRWB16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}