BibTeX record conf/3dic/TehCQAOGMSMCWMGD09

download as .bib file

@inproceedings{DBLP:conf/3dic/TehCQAOGMSMCWMGD09,
  author       = {Weng Hong Teh and
                  Raymond Caramto and
                  Jamal Qureshi and
                  Sitaram Arkalgud and
                  M. O'Brien and
                  T. Gilday and
                  Kou Maekawa and
                  T. Saito and
                  Kouichi Maruyama and
                  Thenappan Chidambaram and
                  Wei Wang and
                  David Marx and
                  David Grant and
                  Russ Dudley},
  title        = {A route towards production-worthy 5 {\(\mathrm{\mu}\)}m {\texttimes}
                  25 {\(\mathrm{\mu}\)}m and 1 {\(\mathrm{\mu}\)}m {\texttimes} 20 {\(\mathrm{\mu}\)}m
                  non-Bosch through-silicon-via {(TSV)} etch, {TSV} metrology, and {TSV}
                  integration},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306562},
  doi          = {10.1109/3DIC.2009.5306562},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/TehCQAOGMSMCWMGD09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics