BibTeX record conf/3dic/VelenisVKDBCSRH19

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@inproceedings{DBLP:conf/3dic/VelenisVKDBCSRH19,
  author       = {Dimitrios Velenis and
                  Joeri De Vos and
                  Soon{-}Wook Kim and
                  Jaber Derakhshandeh and
                  Pieter Bex and
                  Giovanni Capuz and
                  Samuel Suhard and
                  Kenneth June Rebibis and
                  Stefaan Van Huylenbroeck and
                  Erik Jan Marinissen and
                  Alain Phommahaxay and
                  Andy Miller and
                  Gerald Beyer and
                  Geert Van der Plas and
                  Eric Beyne},
  title        = {Process Complexity and Cost Considerations of Multi-Layer Die Stacks},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058876},
  doi          = {10.1109/3DIC48104.2019.9058876},
  timestamp    = {Thu, 14 Oct 2021 09:53:38 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/VelenisVKDBCSRH19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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