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BibTeX record conf/3dic/VelenisVKDBCSRH19
@inproceedings{DBLP:conf/3dic/VelenisVKDBCSRH19, author = {Dimitrios Velenis and Joeri De Vos and Soon{-}Wook Kim and Jaber Derakhshandeh and Pieter Bex and Giovanni Capuz and Samuel Suhard and Kenneth June Rebibis and Stefaan Van Huylenbroeck and Erik Jan Marinissen and Alain Phommahaxay and Andy Miller and Gerald Beyer and Geert Van der Plas and Eric Beyne}, title = {Process Complexity and Cost Considerations of Multi-Layer Die Stacks}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, pages = {1--6}, publisher = {{IEEE}}, year = {2019}, url = {https://doi.org/10.1109/3DIC48104.2019.9058876}, doi = {10.1109/3DIC48104.2019.9058876}, timestamp = {Thu, 14 Oct 2021 09:53:38 +0200}, biburl = {https://dblp.org/rec/conf/3dic/VelenisVKDBCSRH19.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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