BibTeX record conf/3dic/YoonKSMC09

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@inproceedings{DBLP:conf/3dic/YoonKSMC09,
  author       = {Seung Wook Yoon and
                  Jae Hoon Ku and
                  Nathapong Suthiwongsunthorn and
                  Pandi Chelvam Marimuthu and
                  Flynn Carson},
  title        = {Fabrication and packaging of microbump interconnections for 3D {TSV}},
  booktitle    = {{IEEE} International Conference on 3D System Integration, 3DIC 2009,
                  San Francisco, California, USA, 28-30 September 2009},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2009},
  url          = {https://doi.org/10.1109/3DIC.2009.5306554},
  doi          = {10.1109/3DIC.2009.5306554},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/YoonKSMC09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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