BibTeX record conf/apccas/DuttRR16

download as .bib file

@inproceedings{DBLP:conf/apccas/DuttRR16,
  author       = {Arko Dutt and
                  Pranab Roy and
                  Hafizur Rahaman},
  title        = {TSV-aware 3-D {IC} structural planning with irregular die-size},
  booktitle    = {2016 {IEEE} Asia Pacific Conference on Circuits and Systems, {APCCAS}
                  2016, Jeju, South Korea, October 25-28, 2016},
  pages        = {713--716},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/APCCAS.2016.7804074},
  doi          = {10.1109/APCCAS.2016.7804074},
  timestamp    = {Tue, 22 Oct 2019 15:21:18 +0200},
  biburl       = {https://dblp.org/rec/conf/apccas/DuttRR16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.