BibTeX record conf/asicon/WeiWWLS15

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@inproceedings{DBLP:conf/asicon/WeiWWLS15,
  author       = {Jiaxing Wei and
                  Jianfeng Wang and
                  Ning Wang and
                  Siyang Liu and
                  Weifeng Sun},
  title        = {A novel stack package solution of {AC-DC} chip for high-power density
                  adapters},
  booktitle    = {2015 {IEEE} 11th International Conference on ASIC, {ASICON} 2015,
                  Chengdu, China, November 3-6, 2015},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/ASICON.2015.7517114},
  doi          = {10.1109/ASICON.2015.7517114},
  timestamp    = {Tue, 27 Jun 2023 15:48:45 +0200},
  biburl       = {https://dblp.org/rec/conf/asicon/WeiWWLS15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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