BibTeX record conf/dac/ChienHLYC14

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@inproceedings{DBLP:conf/dac/ChienHLYC14,
  author       = {Jui{-}Hung Chien and
                  Ruei{-}Siang Hsu and
                  Hsueh{-}Ju Lin and
                  Ka{-}Yi Yeh and
                  Shih{-}Chieh Chang},
  title        = {Contactless Stacked-die Testing for Pre-bond Interposers},
  booktitle    = {The 51st Annual Design Automation Conference 2014, {DAC} '14, San
                  Francisco, CA, USA, June 1-5, 2014},
  pages        = {8:1--8:6},
  publisher    = {{ACM}},
  year         = {2014},
  url          = {https://doi.org/10.1145/2593069.2593111},
  doi          = {10.1145/2593069.2593111},
  timestamp    = {Tue, 06 Nov 2018 16:58:17 +0100},
  biburl       = {https://dblp.org/rec/conf/dac/ChienHLYC14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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