BibTeX record conf/dac/DevWR13

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@inproceedings{DBLP:conf/dac/DevWR13,
  author    = {Kapil Dev and
               Gary Woods and
               Sherief Reda},
  title     = {High-throughput {TSV} testing and characterization for 3D integration
               using thermal mapping},
  booktitle = {The 50th Annual Design Automation Conference 2013, {DAC} '13, Austin,
               TX, USA, May 29 - June 07, 2013},
  pages     = {73:1--73:6},
  year      = {2013},
  crossref  = {DBLP:conf/dac/2013},
  url       = {https://doi.org/10.1145/2463209.2488823},
  doi       = {10.1145/2463209.2488823},
  timestamp = {Tue, 06 Nov 2018 16:58:19 +0100},
  biburl    = {https://dblp.org/rec/bib/conf/dac/DevWR13},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/dac/2013,
  title     = {The 50th Annual Design Automation Conference 2013, {DAC} '13, Austin,
               TX, USA, May 29 - June 07, 2013},
  publisher = {{ACM}},
  year      = {2013},
  url       = {http://dl.acm.org/citation.cfm?id=2463209},
  isbn      = {978-1-4503-2071-9},
  timestamp = {Mon, 27 May 2013 21:33:41 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/dac/2013},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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