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BibTeX record conf/iccad/PathakPPL11
@inproceedings{DBLP:conf/iccad/PathakPPL11, author = {Mohit Pathak and Jiwoo Pak and David Z. Pan and Sung Kyu Lim}, editor = {Joel R. Phillips and Alan J. Hu and Helmut Graeb}, title = {Electromigration modeling and full-chip reliability analysis for {BEOL} interconnect in TSV-based 3D ICs}, booktitle = {2011 {IEEE/ACM} International Conference on Computer-Aided Design, {ICCAD} 2011, San Jose, California, USA, November 7-10, 2011}, pages = {555--562}, publisher = {{IEEE} Computer Society}, year = {2011}, url = {https://doi.org/10.1109/ICCAD.2011.6105385}, doi = {10.1109/ICCAD.2011.6105385}, timestamp = {Fri, 24 Mar 2023 00:01:53 +0100}, biburl = {https://dblp.org/rec/conf/iccad/PathakPPL11.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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