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BibTeX record conf/icicdt/GuoPIECWMGCRBJV12
@inproceedings{DBLP:conf/icicdt/GuoPIECWMGCRBJV12, author = {Wei Guo and Geert Van der Plas and Andrej Ivankovic and Geert Eneman and Vladimir Cherman and Bart De Wachter and Abdelkarim Mercha and Mario Gonzalez and Yann Civale and Augusto Redolfi and Thibault Buisson and A. Jourdan and Bart Vandevelde and Kenneth J. Rebibis and Ingrid De Wolf and Antonio La Manna and Gerald Beyer and Eric Beyne and Bart Swinnen}, title = {3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and {\(\mu\)}-bumps}, booktitle = {{IEEE} International Conference on {IC} Design {\&} Technology, {ICICDT} 2012, Austin, TX, USA, May 30 - June 1, 2012}, pages = {1--4}, publisher = {{IEEE}}, year = {2012}, url = {https://doi.org/10.1109/ICICDT.2012.6232855}, doi = {10.1109/ICICDT.2012.6232855}, timestamp = {Thu, 14 Oct 2021 10:45:17 +0200}, biburl = {https://dblp.org/rec/conf/icicdt/GuoPIECWMGCRBJV12.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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