BibTeX record conf/icicdt/GuoPIECWMGCRBJV12

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@inproceedings{DBLP:conf/icicdt/GuoPIECWMGCRBJV12,
  author       = {Wei Guo and
                  Geert Van der Plas and
                  Andrej Ivankovic and
                  Geert Eneman and
                  Vladimir Cherman and
                  Bart De Wachter and
                  Abdelkarim Mercha and
                  Mario Gonzalez and
                  Yann Civale and
                  Augusto Redolfi and
                  Thibault Buisson and
                  A. Jourdan and
                  Bart Vandevelde and
                  Kenneth J. Rebibis and
                  Ingrid De Wolf and
                  Antonio La Manna and
                  Gerald Beyer and
                  Eric Beyne and
                  Bart Swinnen},
  title        = {3D chip package interaction thermo-mechanical challenges: Proximity
                  effects of Through Silicon vias and {\(\mu\)}-bumps},
  booktitle    = {{IEEE} International Conference on {IC} Design {\&} Technology,
                  {ICICDT} 2012, Austin, TX, USA, May 30 - June 1, 2012},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2012},
  url          = {https://doi.org/10.1109/ICICDT.2012.6232855},
  doi          = {10.1109/ICICDT.2012.6232855},
  timestamp    = {Thu, 14 Oct 2021 10:45:17 +0200},
  biburl       = {https://dblp.org/rec/conf/icicdt/GuoPIECWMGCRBJV12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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