BibTeX record conf/iecon/ButtayRALB18

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@inproceedings{DBLP:conf/iecon/ButtayRALB18,
  author    = {Cyril Buttay and
               Raphel Riva and
               Bruno Allard and
               Marie{-}Laure Locatelli and
               Vincent Bley},
  title     = {Packaging with Double-Side Cooling Capability for SiC Devices, Based
               on Silver Sintering},
  booktitle = {{IECON} 2018 - 44th Annual Conference of the {IEEE} Industrial Electronics
               Society, Washington, DC, USA, October 21-23, 2018},
  pages     = {5753--5759},
  year      = {2018},
  crossref  = {DBLP:conf/iecon/2018},
  url       = {https://doi.org/10.1109/IECON.2018.8591117},
  doi       = {10.1109/IECON.2018.8591117},
  timestamp = {Wed, 16 Oct 2019 14:14:49 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/iecon/ButtayRALB18},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/iecon/2018,
  title     = {{IECON} 2018 - 44th Annual Conference of the {IEEE} Industrial Electronics
               Society, Washington, DC, USA, October 21-23, 2018},
  publisher = {{IEEE}},
  year      = {2018},
  url       = {https://ieeexplore.ieee.org/xpl/conhome/8560606/proceeding},
  isbn      = {978-1-5090-6684-1},
  timestamp = {Wed, 16 Oct 2019 14:14:49 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/iecon/2018},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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