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BibTeX record conf/iscas/YousufHC15
@inproceedings{DBLP:conf/iscas/YousufHC15, author = {Abdul Hamid Bin Yousuf and Nahid M. Hossain and Masud H. Chowdhury}, title = {Performance analysis of through silicon via {(TSV)} and through glass via {(TGV)} for different materials}, booktitle = {2015 {IEEE} International Symposium on Circuits and Systems, {ISCAS} 2015, Lisbon, Portugal, May 24-27, 2015}, pages = {1957--1960}, publisher = {{IEEE}}, year = {2015}, url = {https://doi.org/10.1109/ISCAS.2015.7169057}, doi = {10.1109/ISCAS.2015.7169057}, timestamp = {Wed, 16 Oct 2019 14:14:49 +0200}, biburl = {https://dblp.org/rec/conf/iscas/YousufHC15.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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