BibTeX record conf/isqed/FurumiIK17

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@inproceedings{DBLP:conf/isqed/FurumiIK17,
  author    = {Kaoru Furumi and
               Masashi Imai and
               Atsushi Kurokawa},
  title     = {Cooling architectures using thermal sidewalls, interchip plates, and
               bottom plate for 3D ICs},
  booktitle = {18th International Symposium on Quality Electronic Design, {ISQED}
               2017, Santa Clara, CA, USA, March 14-15, 2017},
  pages     = {283--288},
  year      = {2017},
  crossref  = {DBLP:conf/isqed/2017},
  url       = {https://doi.org/10.1109/ISQED.2017.7918329},
  doi       = {10.1109/ISQED.2017.7918329},
  timestamp = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/isqed/FurumiIK17},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/isqed/2017,
  title     = {18th International Symposium on Quality Electronic Design, {ISQED}
               2017, Santa Clara, CA, USA, March 14-15, 2017},
  publisher = {{IEEE}},
  year      = {2017},
  url       = {https://ieeexplore.ieee.org/xpl/conhome/7910185/proceeding},
  isbn      = {978-1-5090-5404-6},
  timestamp = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/isqed/2017},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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