BibTeX record conf/isqed/HwangLW12

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@inproceedings{DBLP:conf/isqed/HwangLW12,
  author       = {Leslie Hwang and
                  Kevin L. Lin and
                  Martin D. F. Wong},
  editor       = {Keith A. Bowman and
                  Kamesh V. Gadepally and
                  Pallab Chatterjee and
                  Mark M. Budnik and
                  Lalitha Immaneni},
  title        = {Thermal via structural design in three-dimensional integrated circuits},
  booktitle    = {Thirteenth International Symposium on Quality Electronic Design, {ISQED}
                  2012, Santa Clara, CA, USA, March 19-21, 2012},
  pages        = {103--108},
  publisher    = {{IEEE}},
  year         = {2012},
  url          = {https://doi.org/10.1109/ISQED.2012.6187481},
  doi          = {10.1109/ISQED.2012.6187481},
  timestamp    = {Sun, 02 Oct 2022 16:10:04 +0200},
  biburl       = {https://dblp.org/rec/conf/isqed/HwangLW12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}