BibTeX record journals/mr/AhnPK17

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@article{DBLP:journals/mr/AhnPK17,
  author       = {Key{-}one Ahn and
                  Se{-}Hoon Park and
                  Young{-}Ho Kim},
  title        = {Degradation of adhesion between Cu and epoxy-based dielectric during
                  exposure to hot humid environments},
  journal      = {Microelectron. Reliab.},
  volume       = {78},
  pages        = {1--10},
  year         = {2017},
  url          = {https://doi.org/10.1016/j.microrel.2017.07.083},
  doi          = {10.1016/J.MICROREL.2017.07.083},
  timestamp    = {Wed, 07 Apr 2021 16:01:17 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/AhnPK17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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