BibTeX record journals/mr/GuLLF18

download as .bib file

@article{DBLP:journals/mr/GuLLF18,
  author       = {Jian Gu and
                  Jian Lin and
                  Yongping Lei and
                  Hanguang Fu},
  title        = {Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration
                  impact failure models after thermal/isothermal cycling},
  journal      = {Microelectron. Reliab.},
  volume       = {80},
  pages        = {29--36},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2017.10.014},
  doi          = {10.1016/J.MICROREL.2017.10.014},
  timestamp    = {Sat, 22 Feb 2020 19:28:37 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/GuLLF18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.