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BibTeX record journals/mr/GuN04
@article{DBLP:journals/mr/GuN04, author = {Yu Gu and Toshio Nakamura}, title = {Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages}, journal = {Microelectron. Reliab.}, volume = {44}, number = {3}, pages = {471--483}, year = {2004}, url = {https://doi.org/10.1016/j.microrel.2003.11.002}, doi = {10.1016/J.MICROREL.2003.11.002}, timestamp = {Sat, 22 Feb 2020 19:26:44 +0100}, biburl = {https://dblp.org/rec/journals/mr/GuN04.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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