BibTeX record journals/mr/GuN04

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@article{DBLP:journals/mr/GuN04,
  author       = {Yu Gu and
                  Toshio Nakamura},
  title        = {Interfacial delamination and fatigue life estimation of 3D solder
                  bumps in flip-chip packages},
  journal      = {Microelectron. Reliab.},
  volume       = {44},
  number       = {3},
  pages        = {471--483},
  year         = {2004},
  url          = {https://doi.org/10.1016/j.microrel.2003.11.002},
  doi          = {10.1016/J.MICROREL.2003.11.002},
  timestamp    = {Sat, 22 Feb 2020 19:26:44 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/GuN04.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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