BibTeX record journals/mr/GuoY15

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@article{DBLP:journals/mr/GuoY15,
  author       = {Xue{-}Ru Guo and
                  Wen{-}Bin Young},
  title        = {Vacuum effect on the void formation of the molded underfill process
                  in flip chip packaging},
  journal      = {Microelectron. Reliab.},
  volume       = {55},
  number       = {3-4},
  pages        = {613--622},
  year         = {2015},
  url          = {https://doi.org/10.1016/j.microrel.2014.12.001},
  doi          = {10.1016/J.MICROREL.2014.12.001},
  timestamp    = {Sat, 22 Feb 2020 19:27:44 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/GuoY15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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