BibTeX record journals/mr/JiangRZIHH13

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@article{DBLP:journals/mr/JiangRZIHH13,
  author       = {Tengfei Jiang and
                  Suk{-}Kyu Ryu and
                  Qiu Zhao and
                  Jay Im and
                  Rui Huang and
                  Paul S. Ho},
  title        = {Measurement and analysis of thermal stresses in 3D integrated structures
                  containing through-silicon-vias},
  journal      = {Microelectron. Reliab.},
  volume       = {53},
  number       = {1},
  pages        = {53--62},
  year         = {2013},
  url          = {https://doi.org/10.1016/j.microrel.2012.05.008},
  doi          = {10.1016/J.MICROREL.2012.05.008},
  timestamp    = {Sat, 22 Feb 2020 19:27:00 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/JiangRZIHH13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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