BibTeX record journals/mr/KimKJ06

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@article{DBLP:journals/mr/KimKJ06,
  author       = {Jong{-}Woong Kim and
                  Dae{-}Gon Kim and
                  Seung{-}Boo Jung},
  title        = {Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu
                  solder bump for flip chip application},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {2-4},
  pages        = {535--542},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2005.06.008},
  doi          = {10.1016/J.MICROREL.2005.06.008},
  timestamp    = {Sat, 22 Feb 2020 19:27:40 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/KimKJ06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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