BibTeX record journals/mr/LinNCCTM04

download as .bib file

@article{DBLP:journals/mr/LinNCCTM04,
  author       = {T. Y. Lin and
                  B. Njoman and
                  D. Crouthamel and
                  K. H. Chua and
                  S. Y. Teo and
                  Y. Y. Ma},
  title        = {The impact of moisture in mold compound preforms on the warpage of
                  {PBGA} packages},
  journal      = {Microelectron. Reliab.},
  volume       = {44},
  number       = {4},
  pages        = {603--609},
  year         = {2004},
  url          = {https://doi.org/10.1016/j.microrel.2003.08.003},
  doi          = {10.1016/J.MICROREL.2003.08.003},
  timestamp    = {Sat, 22 Feb 2020 19:28:42 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LinNCCTM04.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.