BibTeX record journals/mr/TaoWDX06

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@article{DBLP:journals/mr/TaoWDX06,
  author       = {Bo Tao and
                  Yiping Wu and
                  Han Ding and
                  You{-}Lun Xiong},
  title        = {A quantitative method of reliability estimation for surface mount
                  solder joints based on heating factor Q\({}_{\mbox{eta}}\)},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {5-6},
  pages        = {864--872},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2005.04.013},
  doi          = {10.1016/J.MICROREL.2005.04.013},
  timestamp    = {Fri, 21 Oct 2022 19:54:49 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/TaoWDX06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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