BibTeX record journals/mr/WangC16

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@article{DBLP:journals/mr/WangC16,
  author       = {Xuan Wang and
                  C. Key Chung},
  title        = {Mechanisms and solutions to the brittle solder joint in electroless
                  Ni plating},
  journal      = {Microelectron. Reliab.},
  volume       = {65},
  pages        = {173--177},
  year         = {2016},
  url          = {https://doi.org/10.1016/j.microrel.2016.08.006},
  doi          = {10.1016/J.MICROREL.2016.08.006},
  timestamp    = {Sat, 22 Feb 2020 19:26:42 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/WangC16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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