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BibTeX record journals/mr/ZhangSZ06
@article{DBLP:journals/mr/ZhangSZ06, author = {Y. L. Zhang and D. X. Q. Shi and Wei Zhou}, title = {Reliability study of underfill/chip interface under accelerated temperature cycling {(ATC)} loading}, journal = {Microelectron. Reliab.}, volume = {46}, number = {2-4}, pages = {409--420}, year = {2006}, url = {https://doi.org/10.1016/j.microrel.2005.04.012}, doi = {10.1016/J.MICROREL.2005.04.012}, timestamp = {Tue, 27 Oct 2020 11:56:09 +0100}, biburl = {https://dblp.org/rec/journals/mr/ZhangSZ06.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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