BibTeX record journals/mr/ZhangSZ06

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@article{DBLP:journals/mr/ZhangSZ06,
  author       = {Y. L. Zhang and
                  D. X. Q. Shi and
                  Wei Zhou},
  title        = {Reliability study of underfill/chip interface under accelerated temperature
                  cycling {(ATC)} loading},
  journal      = {Microelectron. Reliab.},
  volume       = {46},
  number       = {2-4},
  pages        = {409--420},
  year         = {2006},
  url          = {https://doi.org/10.1016/j.microrel.2005.04.012},
  doi          = {10.1016/J.MICROREL.2005.04.012},
  timestamp    = {Tue, 27 Oct 2020 11:56:09 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/ZhangSZ06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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