BibTeX record journals/tcad/NoiaC13

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@article{DBLP:journals/tcad/NoiaC13,
  author       = {Brandon Noia and
                  Krishnendu Chakrabarty},
  title        = {Pre-Bond Probing of Through-Silicon Vias in 3-D Stacked ICs},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {32},
  number       = {4},
  pages        = {547--558},
  year         = {2013},
  url          = {https://doi.org/10.1109/TCAD.2012.2226455},
  doi          = {10.1109/TCAD.2012.2226455},
  timestamp    = {Mon, 03 Jan 2022 22:11:38 +0100},
  biburl       = {https://dblp.org/rec/journals/tcad/NoiaC13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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