BibTeX record journals/tcad/ZhuDY19

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@article{DBLP:journals/tcad/ZhuDY19,
  author       = {Weijun Zhu and
                  Gang Dong and
                  Yintang Yang},
  title        = {Thermal-Aware Modeling and Analysis for a Power Distribution Network
                  Including Through-Silicon-Vias in 3-D ICs},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {38},
  number       = {7},
  pages        = {1278--1290},
  year         = {2019},
  url          = {https://doi.org/10.1109/TCAD.2018.2846659},
  doi          = {10.1109/TCAD.2018.2846659},
  timestamp    = {Thu, 24 Sep 2020 11:28:47 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/ZhuDY19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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