BibTeX record journals/tcas/ChouKSW13

download as .bib file

@article{DBLP:journals/tcas/ChouKSW13,
  author       = {Yung{-}Fa Chou and
                  Ding{-}Ming Kwai and
                  Ming{-}Der Shieh and
                  Cheng{-}Wen Wu},
  title        = {Reactivation of Spares for Off-Chip Memory Repair After Die Stacking
                  in a 3-D {IC} With TSVs},
  journal      = {{IEEE} Trans. Circuits Syst. {I} Regul. Pap.},
  volume       = {60-I},
  number       = {9},
  pages        = {2343--2351},
  year         = {2013},
  url          = {https://doi.org/10.1109/TCSI.2013.2246235},
  doi          = {10.1109/TCSI.2013.2246235},
  timestamp    = {Sat, 30 Sep 2023 10:27:52 +0200},
  biburl       = {https://dblp.org/rec/journals/tcas/ChouKSW13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.