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"Wafer-level hybrid bonding technology with copper/polymer co-planarization."

Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda (2010)

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DOI: 10.1109/3DIC.2010.5751471

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/3dic/AokiHT10
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Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda:
Wafer-level hybrid bonding technology with copper/polymer co-planarization. 3DIC 2010: 1-4

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