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"Advances toward reliable high density Cu-Cu interconnects by ..."

Yann Beilliard et al. (2014)

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DOI: 10.1109/3DIC.2014.7274306

access: closed

type: Conference or Workshop Paper

metadata version: 2021-01-21

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Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix:
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO₂ direct hybrid bonding. 3DIC 2014: 1-8

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