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"Development of Laser-Assisted Bonding with Compression (LABC) Process for ..."

Kwang-Seong Choi et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058890

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-19

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  - conf/3dic/ChoiEMJLKK19
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Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim:
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration. 3DIC 2019: 1-3

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