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"An innovative die to wafer 3D integration scheme: Die to wafer oxide or ..."

Léa Di Cioccio et al. (2009)

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DOI: 10.1109/3DIC.2009.5306534

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/3dic/CioccioGTSBVZVDLABCCC09
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  persistent URL:
  - https://dblp.org/rec/conf/3dic/CioccioGTSBVZVDLABCCC09
Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier:
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. 3DIC 2009: 1-4

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