"Predictive High Frequency effects of substrate coupling in 3D integrated ..."

Elie Eid et al. (2009)

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DOI: 10.1109/3DIC.2009.5306547

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type: Conference or Workshop Paper

metadata version: 2023-06-12

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Elie Eid, Thierry Lacrevaz, Sébastien de Rivaz, Cédric Bermond, Bernard Fléchet, Françis Calmon, Christian Gontrand, Alexis Farcy, Lionel Cadix, Pascal Ancey:
Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking. 3DIC 2009: 1-6

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