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"Thermal requirements in future 3D processors."

Paul D. Franzon, Avi Bar-Cohen (2013)

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DOI: 10.1109/3DIC.2013.6702402

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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  dblp key:
  - conf/3dic/FranzonB13
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  - https://dblp.org/rec/conf/3dic/FranzonB13
Paul D. Franzon, Avi Bar-Cohen:
Thermal requirements in future 3D processors. 3DIC 2013: 1-6

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