"Equipment challenges and solutions for diverse temporary bonding and ..."

Markus Gabriel et al. (2010)

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DOI: 10.1109/3DIC.2010.5751478

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Markus Gabriel, Thomas Knauer, Peter Bisson, Sumant Sood, Wilfried Bair, Jim Hermanowski:
Equipment challenges and solutions for diverse temporary bonding and de-bonding processes in 3D integration. 3DIC 2010: 1-5

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