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"Investigation of the Influence of Material Properties on Warpage and ..."

Koji Hamaguchi et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058902

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-19

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  - conf/3dic/HamaguchiNSSN19
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  - https://dblp.org/rec/conf/3dic/HamaguchiNSSN19
Koji Hamaguchi, Mitsuki Nakata, Kouta Segawa, Naoya Suzuki, Toshihisa Nonaka:
Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package. 3DIC 2019: 1-6

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