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"High density 3D integration by pre-applied Inter Chip Fill."

Akihiro Horibe et al. (2010)

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DOI: 10.1109/3DIC.2010.5751461

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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  dblp key:
  - conf/3dic/HoribeSSKMKOMY10
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  - https://dblp.org/rec/conf/3dic/HoribeSSKMKOMY10
Akihiro Horibe, Kuniaki Sueoka, Katsuyuki Sakuma, Sayuri Kohara, Keiji Matsumoto, Hidekazu Kikuchi, Yasumitsu Orii, Toshiro Mitsuhashi, Fumiaki Yamada:
High density 3D integration by pre-applied Inter Chip Fill. 3DIC 2010: 1-5

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