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"Advanced 3D chip stack process for thin dies with fine pitch bumps using ..."

Akihiro Horibe, Fumiaki Yamada (2009)

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DOI: 10.1109/3DIC.2009.5306555

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Akihiro Horibe, Fumiaki Yamada:
Advanced 3D chip stack process for thin dies with fine pitch bumps using pre-applied inter chip fill. 3DIC 2009: 1-4

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