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"Wafer level encapsulated materials evaluation for chip on wafer (CoW) ..."

Sylvain Joblot et al. (2013)

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DOI: 10.1109/3DIC.2013.6702394

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy:
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. 3DIC 2013: 1-7

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